Signal HS-V Suggested layer stackups for 4, 6, 8, 10 and 12 layer boards. To summarize, the process of routing a board with high speed signals requires you to manage: Termination components that may be required The definition of the signals that need high-speed design rules applied to them The mechanical dimensions of the routes - for controlled impedance routing The properties and dimensions of the board materials The quantity and arrangement of the layers in the layer stack The return path of each high speed signal The impact of vias The configuration and routing of differential pairs Configuring and controlling the route lengths Pre- and Post-layout Signal Integrity Analysis Early in the design process, it is important to identify signals that might require impedance matching, so that additional termination components can be included before the component placement process is complete. Since output pins are typically low impedance and input pins are typically high impedance, termination components may need to be added to the design to achieve impedance matching. The simulator is based on a Fast Reflection and Crosstalk Simulator, which produces very accurate simulations using industry-proven algorithms.
This facilitates both embedded components as well as creation of rigid-flex circuits. Altium Designer utilized its unique viewing mode - Board Planning Mode - for just this.
Altium 17: Creating a component Library (Footprint and Schematic)